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乐视X620全字库Selected: [HYNIX] H9TQ26ACLTMCUR/32GB (BGA221)

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!poston!: 2018-4-2 14:37:26
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  • 资料详情
  • 适用编程器(programmer):UP-828、EPR-BOX、E-MATE、U盘
  • 适用品牌:其他(other)
  • 资料名称:X620 Selected: [HYNIX] H9TQ26ACLTMCUR/32GB (BGA221)

eMMC之家提醒您:

1、如果无法解压,请确保已安装“360压缩”软件再进行解压
2、2014-07-20之前上传的资料请再安装“haozip好压”解压
2、自2014-07-20更新之后的资料统一需要使用“360压缩”进行解压
3、如果遇到无法解压的问题,请联系QQ:66100734
4、如果发现资料无法使用以及字库编辑等使用问题,请联系QQ:785026608
5、压缩包解压密码统一为:www.moorc.com或者www.emmchome.com
6、请使用浏览器自带下载工具直接下载,勿使用迅雷等下载,否则会造成不能下载或者不能下载完整
7、必须登录才能查看所有附件,务必将所有附件下载完才能解压。

VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: HBG4a2 (0x484247346132), rev: 0xA4, serial number: 0x5783D609
Manufacturing date: 浜旀湀 2016
CID: 90014A48 42473461 32A45783 D609537C
CSD: D0270132 8F5903FF FFFFFFE7 8A400016
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 1 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditi**: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
Internal storage: 24.39 GiB
crypto state: unencrypted

ANDROID ROM info:
platform: MT6797, cpu abi: arm64-v8a
manufacturer: LeMobile
board: Le2_CN1, name: Le2_CN1
brand: LeEco, model: Le X620
build id: HEXCNFN5902812161S, version: 6.0 Marshmallow (HEXCNFN5902812161S)
build description: full_s2_plus-user 6.0 HEXCNFN5902812161S 1513359015 release-keys

Selected: [HYNIX] H9TQ26ACLTMCUR/32GB   (BGA221)


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